Wafer IC failure mode
Failure Classification
Physical Failure (Structure)
- Popcorn
- Delamination
- Crack (Package/Die)
Electrical Failure (Connection)
- Open
- Short
- Leakage
- Function
In-Process Failure (Production)
- Front-end (before molding)
- Back-end (After molding)
- Testing (FT/Burn-in)
Reliability Failure (Qualification)
- Temperature
- Humidity
- Pressure
- Voltage
Popcorn (爆裂)
TQFP package (bottom popcorn)
FBGA package (top popcorn)
Delamination (離裂)
Crack (破裂)
Assembly Flow 裝配流程
Wiring Bondability (TSOP/BGA)
Inner Lead Bondability (TCP/COF) 內部引線可焊性（TCP/COF）
Bondability (Bonding Force) 可結合性，可焊性（結合力）
X-RAY Inspection (NDT)
2nd BondingBroken
Open Failure
Short Failure
Short Failure (Tin Whisker)
Short Failure
Leakage Failure
Function Failure
Assembled Related – Machine/Man Damaged
Assembled Related – Environment (Particle Damaged)
ESD Cases of Driver ICs
Difference between ESD and EOS
Major Mode of Damages by ESD